JPH0625965Y2 - ガラス封止形半導体素子収納用パッケージ - Google Patents
ガラス封止形半導体素子収納用パッケージInfo
- Publication number
- JPH0625965Y2 JPH0625965Y2 JP5580088U JP5580088U JPH0625965Y2 JP H0625965 Y2 JPH0625965 Y2 JP H0625965Y2 JP 5580088 U JP5580088 U JP 5580088U JP 5580088 U JP5580088 U JP 5580088U JP H0625965 Y2 JPH0625965 Y2 JP H0625965Y2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- semiconductor element
- insulating substrate
- package
- external lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 42
- 239000011521 glass Substances 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 30
- 238000007789 sealing Methods 0.000 claims description 7
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 4
- 239000005394 sealing glass Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000012777 electrically insulating material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910017709 Ni Co Inorganic materials 0.000 description 1
- 229910003267 Ni-Co Inorganic materials 0.000 description 1
- 229910003262 Ni‐Co Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000006060 molten glass Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5580088U JPH0625965Y2 (ja) | 1988-04-25 | 1988-04-25 | ガラス封止形半導体素子収納用パッケージ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5580088U JPH0625965Y2 (ja) | 1988-04-25 | 1988-04-25 | ガラス封止形半導体素子収納用パッケージ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01162246U JPH01162246U (en]) | 1989-11-10 |
| JPH0625965Y2 true JPH0625965Y2 (ja) | 1994-07-06 |
Family
ID=31281701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5580088U Expired - Lifetime JPH0625965Y2 (ja) | 1988-04-25 | 1988-04-25 | ガラス封止形半導体素子収納用パッケージ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0625965Y2 (en]) |
-
1988
- 1988-04-25 JP JP5580088U patent/JPH0625965Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01162246U (en]) | 1989-11-10 |
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